PACKAGING MODULE AND SUBSTRATE STRUCTURE THEREOF

摘要

A substrate structure is provided, including: a circuit board having a plurality of wiring layers; a first circuit layer; a plurality of conductive posts disposed on the first circuit layer; a first insulating layer encapsulating the circuit board, the first circuit layer and the conductive posts; and a second circuit layer formed on the first insulating layer and electrically connected to the wiring layers with the second circuit layer electrically connected to the first circuit layer through the conductive posts. According to the present disclosure, fine-pitch circuits are formed in the circuit board, and thus only the circuit board needs a high-cost insulating material, thereby allowing the first insulating layer to be made of a low-cost material to reduce the fabrication cost.

主权项

1. A substrate structure, comprising:
a first insulating layer having a first surface and a second surface opposite to the first surface; a first circuit layer embedded in the first insulating layer and exposed from the first surface of the first insulating layer; a plurality of conductive posts disposed in the first insulating layer and electrically connected to the first circuit layer; a circuit board embedded in the first insulating layer, communicating with the first surface and the second surface of the first insulating layer, and having a plurality of wiring layers with a portion of the wiring layers exposed from the first surface and the second surface of the first insulating layer; and a second circuit layer formed on the circuit board and the second surface of the first insulating layer and electrically connected to the wiring layers, wherein the first circuit layer is electrically connected to the second circuit layer through the conductive posts.