| 发明名称 |
RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONIC DEVICE ELEMENT, RESIN SHEET FOR SEALING ORGANIC ELECTRONIC DEVICE ELEMENT, ORGANIC ELECTROLUMINESCENT ELEMENT, AND IMAGE DISPLAY APPARATUS |
| 摘要 |
A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus. |
| 申请公布号 |
US2017047548(A1) |
申请公布日期 |
2017.02.16 |
| 申请号 |
US201615280198 |
申请日期 |
2016.09.29 |
| 申请人 |
FURUKAWA ELECTRIC CO., LTD. |
发明人 |
MIEDA Tetsuya;ISHIGURO Kunihiko |
| 分类号 |
H01L51/52;C09D123/22;C09D109/06;C08L9/02;C09D109/02;C08L9/06;C08L23/22;H01L51/00 |
主分类号 |
H01L51/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity. |
| 地址 |
Tokyo JP |
