SUPPORT PLATE AND METHOD FOR FORMING SUPPORT PLATE

摘要

A support plate to which a front surface of a wafer having a device region in which plural devices are formed and a peripheral surplus region surrounding the device region on the front surface is stuck. The support plate includes a base plate in which a recess is formed in a front surface region corresponding to the device region of the wafer to be stuck to the support plate and an annular groove is formed in a region corresponding to the peripheral surplus region of the wafer, and a soft member packed in the recess of the base plate. The wafer is stuck to a front surface of the support plate with the intermediary of an adhesive by injecting the adhesive into the annular groove.

主权项

1. A method for processing a wafer having a device region in which a plurality of devices are formed and a peripheral surplus region surrounding the device region on a front surface thereof, the method comprising:
a support plate preparing step of preparing a support plate including a base plate in which a recess is formed in a front surface region corresponding to the device region of the wafer to be stuck to the support plate and an annular groove is formed in a region corresponding to the peripheral surplus region of the wafer and a soft member packed in the recess of the base plate; an adhesive injecting step of injecting an adhesive into the annular groove of the support plate; a sticking step of sticking the wafer onto the support plate with intermediary of the adhesive in such a manner that the device region of the wafer abuts against the soft member after carrying out the adhesive injecting step; a processing step of holding the wafer with intermediary of the support plate and performing processing on the wafer after carrying out the sticking step; and an adhesive removing step of making a cutting blade cut into a region corresponding to the annular groove of the support plate and removing the adhesive after carrying out the processing step, wherein said adhesive removing step includes rotating the cutting blade about a blade spindle that extends in the vertical direction while rotating the wafer about a spindle that extends in the vertical direction.