| 发明名称 |
ULTRASONIC TRANSDUCER CHIP ASSEMBLY, ULTRASOUND PROBE, ULTRASONIC IMAGING SYSTEM AND ULTRASOUND ASSEMBLY AND PROBE MANUFACTURING METHODS |
| 摘要 |
Disclosed is an ultrasonic transducer assembly comprising an ultrasonic transducer chip (100) having a main surface comprising a plurality of ultrasound transducer elements (112) and a plurality of first contacts (120) for connecting to said ultrasound transducer elements; a contact chip (400) having a further main surface comprising a plurality of second contacts (420); an backing member (300) comprising ultrasound absorbing and/or scattering bodies (310), said backing member comprising a first surface (302) on which the transducer chip is mounted and a second surface (306) on which the contact chip is mounted; and a flexible interconnect (200) extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks (210), each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed. |
| 申请公布号 |
US2017043375(A1) |
申请公布日期 |
2017.02.16 |
| 申请号 |
US201515305414 |
申请日期 |
2015.05.05 |
| 申请人 |
KONINKLIJKE PHILIPS N.V. ;TECHNISCHE UNIVERSITEIT DELFT |
发明人 |
Weekamp Johannes Wilhelmus;Henneken Vincent Adrianus;Groenland Alfons Wouter;Louwerse Marcus Cornelis |
| 分类号 |
B06B1/06;A61B8/00;H01L41/293;H01L41/047;H01L41/113 |
主分类号 |
B06B1/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An ultrasonic transducer assembly comprising:
an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements; a contact chip having a further main surface comprising a plurality of second contacts for contacting a signal processing assembly; a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is located and a second surface on which the contact chip is located; and a flexible interconnect extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact. |
| 地址 |
EINDHOVEN NL |
