ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

The electronic component includes a semiconductor substrate, a first doped region, a second doped region, a gate structure, a dielectric layer and a conductive portion. The semiconductor substrate has an upper surface. first doped region embedded in the semiconductor substrate. The second doped region is embedded in the semiconductor substrate. The gate structure is formed on the upper surface. The dielectric layer is formed above the upper surface and located between the first doped region and the second doped region. The conductive portion is formed on the dielectric layer.

主权项

1. An electronic component, comprising:
a semiconductor substrate having an upper surface; a first doped region embedded in the semiconductor substrate; a second doped region embedded in the semiconductor substrate; a gate structure formed on the upper surface; a dielectric layer formed above the upper surface and located between the first doped region and the second doped region; and a conductive portion formed on the dielectric layer.