| 发明名称 |
MOLDS AND METHODS TO CONTROL MOLD SURFACE QUALITY |
| 摘要 |
A method for treating a mold includes grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and polishing the outer metal surface after the lapping to achieve an average surface roughness (Ra) less than or equal to about 0.15 μm and a waviness height (Wa) less than or equal to about 100 nm. A mold for shaping glass-based material can include a mold body having an outer metal surface, wherein the outer metal surface has an average surface roughness (Ra) less than or equal to about 0.15 μm and a waviness height (Wa) less than or equal to about 100 nm. |
| 申请公布号 |
US2017044045(A1) |
申请公布日期 |
2017.02.16 |
| 申请号 |
US201615234114 |
申请日期 |
2016.08.11 |
| 申请人 |
CORNING INCORPORATED |
发明人 |
Chiang Yi-Chun;Hall Jill Marie;Li Shen;Ukrainczyk Ljerka;Wang Hong Chih;Hsu Fang-Yu |
| 分类号 |
C03B23/03;B24B37/11;C03C3/091;C03C3/093;C22C19/05;C03C3/095 |
主分类号 |
C03B23/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for treating a mold, the method comprising:
grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and polishing the outer metal surface after the lapping to achieve an average surface roughness (Ra) less than or equal to about 0.15 μm and a waviness (Wa) less than or equal to about 100 nm. |
| 地址 |
Corning NY US |
