发明名称 プラズマ処理装置
摘要 PROBLEM TO BE SOLVED: To reduce influence as much as possible on the electron density distribution on a placing table and the in-plane uniformity of process characteristics when a filter unit is provided on a heater feeding line electrically connecting a heating element inside of the placing table placed in a processing container and a heater power supply placed outside the processing container.SOLUTION: In a plasma processing device, a heating element 50 provided inside a susceptor 12 is electrically connected with a heater power supply 58 (IN) outside a chamber 10 via an inner conductor 51 going through inside the susceptor 12, a feeding conductor 52 longitudinally going through space SP, a filter unit 54, and an electric cable 56. A casing 110 of the filter unit 54 is fit, vertically from below the chamber 10, into an opening 114 formed on a bottom wall (base) 10a of the chamber 10 next to a cylindrical conductor cover 42 enclosing the periphery of a feeding stick 40, and physically and electrically coupled to the chamber bottom wall 10a.
申请公布号 JP6081292(B2) 申请公布日期 2017.02.15
申请号 JP20130107194 申请日期 2013.05.21
申请人 東京エレクトロン株式会社 发明人 奥西 直彦
分类号 H01L21/3065;H01L21/205;H01L21/31;H01L21/683;H05H1/46 主分类号 H01L21/3065
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