| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-divided sputtering target obtained by bonding multiple target members, of which solder material is not exposed at a divided part, and which can reduce nodule generation amount in the vicinity of the divided part, and to provide a manufacturing method of the multi-divided sputtering target.SOLUTION: Providing a wire-shaped protective material along a bottom part of a divided part formed by mutually neighboring target material allows manufacturing a sputtering target where the solder material is not exposed at the divided part, and a multi-divided sputtering target which can reduce the amount of nodules generated during sputtering in the vicinity of the divided part can be obtained. |
