| 发明名称 | Center flex single side polishing head having recess and cap | ||
| 摘要 | A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive. | ||
| 申请公布号 | US9566687(B2) | 申请公布日期 | 2017.02.14 |
| 申请号 | US201414512779 | 申请日期 | 2014.10.13 |
| 申请人 | SunEdison Semiconductor Limited (UEN201334164H) | 发明人 | Albrecht Peter;Bhagavat Sumeet;Chu Alex;Yoshimura Ichiro;Xin Yunbiao;Vandamme Roland |
| 分类号 | B24B7/22;B24B37/30;H01L21/67 | 主分类号 | B24B7/22 |
| 代理机构 | Armstrong Teasdale LLP | 代理人 | Armstrong Teasdale LLP |
| 主权项 | 1. A polishing head assembly for single side polishing of silicon wafers, the polishing head assembly comprising: a polishing head having a downwardly extending annular member defining a recess along a bottom portion of the polishing head, the annular member having an inner surface, the recess having a recessed surface; and a cap positioned within the recess, the cap having an annular wall and a floor extending across the annular wall, the floor being spaced from the recessed surface to form a chamber therebetween, the chamber configured to be pressurized for deflecting the floor, the annular wall being attached to the inner surface of the annular member along an outer surface of the annular wall with an adhesive. | ||
| 地址 | Singapore SG | ||