Insulating film, method for manufacturing semiconductor device, and semiconductor device

摘要

In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.

主权项

1. A semiconductor device comprising:
a first gate electrode; an oxide semiconductor film comprising indium, gallium, and zinc over the first gate electrode; a second gate electrode comprising a first conductive film and a second conductive film over the oxide semiconductor film; and a protective film over the second gate electrode, wherein an indium concentration is larger than a gallium concentration in the oxide semiconductor film, wherein the first conductive film comprises indium, zinc, and oxide, wherein the second conductive film comprises a metal element, and wherein the protective film is an oxide insulating film in which a spin density of a signal at g=2.001, measured by electron spin resonance, is lower than 1.5×1018 spins/cm3.