发明名称 Direct integration of photovoltaic device into circuit board
摘要 Aspects relate to an integrated system that is electrically powered. The integrated system includes a circuit board and a photovoltaic device. The circuit board includes one or more on-board electronic components and an upper surface configured as a substrate. The photovoltaic device is integrally deposited on the upper surface of the circuit board and electrically connected to the one or more on-board electronic components, wherein the upper surface of the circuit board is a photovoltaic device substrate.
申请公布号 US9570915(B1) 申请公布日期 2017.02.14
申请号 US201514977700 申请日期 2015.12.22
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Gershon Talia S.;Haight Richard A.;Hannon James B.;Todorov Teodor K.
分类号 H02J1/10;H02J3/38;H02J7/34;H02S40/38;H05K1/18;H01L31/0224;H01L31/048;H01L31/05;H01L31/18;H01L31/02;H05K3/32;H05K1/16;H05K3/00;H05K3/28;H01L31/0203;H02J7/35 主分类号 H02J1/10
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP ;Alexanian Vazken
主权项 1. An integrated system that is electrically powered, the integrated system comprising: a circuit board comprising: one or more on-board electronic components; andan upper surface configured as a substrate; anda photovoltaic device integrally deposited on the upper surface of the circuit board and electrically connected to the one or more on-board electronic components, wherein the photovoltaic device comprises,a bottom electrode integrally deposited on the upper surface of the circuit board;a semi-conductor absorber layer deposited on the bottom electrode, wherein the semi-conductor absorber layer is one selected group consisting of a combination of semi-conductor layers and a single semi-conductor layer with p- and n-type materials mixed in;a buffer layer deposited on the semi-conductor absorber layer; anda top electrode deposited on the buffer layer; wherein the upper surface of the circuit board is a photovoltaic device substrate.
地址 Armonk NY US