| 摘要 |
Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber. The exhaust member includes a plurality of individual exhaust lines connecting a plurality of process chambers to each other and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module. |
| 主权项 |
1. An apparatus treating apparatus comprising:
a load port on which a carrier accommodating a substrate is seated; a substrate treating module comprising one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate; and a substrate transfer module comprising a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module, wherein the reflow treating unit comprises: a process chamber having a treating space therein; and an exhaust member exhausting a fluid within the process chamber, wherein the exhaust member comprises: a plurality of individual exhaust lines connecting a plurality of process chambers to each other; and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module, wherein the exhaust member further comprises a trap removing impurities of the exhausted fluid, wherein the trap is provided in plurality, and the plurality of traps are disposed on the plurality of individual exhaust lines, respectively, wherein the trap is separable from each of the plurality of individual exhaust lines; and wherein the plurality of process chambers are arranged in a circular ring shape, the common exhaust line is disposed at a center of the ring shape, and wherein each of the individual exhaust lines radially extends from the center of the ring shape when viewed from an upper side; and wherein the reflow treating unit also comprises: a plurality of process chambers each having a treating space therein, the exhaust chambers being arranged in a ring shape; a support member disposed within the treating space; an exhaust member connected to a top surface of each process chamber to exhaust a fluid from within the treating space, wherein the exhaust member further comprises an exhaust line in communication with each process chamber, each exhaust line includes a top accessible, separable, impurity removing trap for removing impurities of the exhausted fluid wherein each trap is separable from its exhaust line and wherein the plurality of process chambers are arranged in a circular ring, with a common exhaust line disposed at the center of the ring above the process chambers, and wherein each of the individual exhaust lines extend radially from the center of the ring arrangement to each process chamber; and an absorption prevention plate spaced apart from an upper portion of the support member, the absorption prevention plate having a flat plate shape with a predetermined thickness; and wherein the reflow treating unit further comprises a heating member enabling the heating the absorption prevention plate. |
