ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

摘要

An electronic component which is provided with: an electronic element (100); a base member (300) having an upper surface (302) on which the electronic element (100) is mounted; and a lid member (200) that is bonded to the base member (300), with a bonding material (350) being interposed therebetween, so as to hermetically seal the electronic element (100). The bonding material (350) is composed of an insulating material containing a first metal. The lid member (200) has at least an outermost layer (214) that is formed on the surface facing the base member (300). The outermost layer (214) of the lid member (200) has a solid solution layer (214a) of a second metal and a metal that is the same as the first metal in at least a part of the outermost layer (214).