CONFORMALLY ENCAPSULATED MULTI-ELECTRODE ARRAYS WITH SEAMLESS INSULATION

摘要

Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.

主权项

1. A method of fabricating an electrode array, comprising:
suspending at least one thin-film electrically conductive trace beam(s) over a substrate, wherein the trace beam(s) is suspended by at least one support portion(s) thereof in contact with the substrate; encapsulating the suspended trace beam(s) in a seamless coating of an electrically insulating material; and removing the substrate to expose an electrically conductive surface of the support portion(s) of the encapsulated trace beam(s).