DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A stacked body including an organic film stacked on and in contact with an inorganic substrate, a wiring pattern, a first resin layer, a light-emitting element layer, and a second resin layer is prepared. The inorganic substrate is detached from the organic film. The stacked body from which the inorganic substrate is detached, an anisotropic conductive layer containing conductive particles having a diameter larger than the thickness of the organic film, and a wiring terminal of a flexible wiring board are disposed on top one another. The stacked body, the anisotropic conductive layer, and the flexible wiring board disposed are thermocompression bonded to cause the conductive particles to enter the organic film, and the wiring pattern and the wiring terminal are electrically connected by means of the conductive particles.

主权项

1. A method of manufacturing a display device, comprising:
preparing a stacked body, the stacked body including an organic film stacked on and in contact with an inorganic substrate, a wiring pattern stacked on the organic film on the side opposite to the inorganic substrate, a first resin layer stacked on the wiring pattern on the side opposite to the organic film, a light-emitting element layer provided so as to emit light whose luminance is controlled for each of a plurality of unit pixels, the light-emitting element layer being disposed on the side of the first resin layer opposite to the wiring pattern with an adhesive layer between the light-emitting element layer and the first resin layer, and a second resin layer disposed on the side of the light-emitting element layer opposite to the first resin layer; detaching the inorganic substrate from the organic film; disposing the stacked body from which the inorganic substrate is detached, an anisotropic conductive layer containing conductive particles having a diameter larger than the thickness of the organic film, and a wiring terminal of a flexible wiring board on top of one another; and thermocompression bonding the stacked body, the anisotropic conductive layer, and the flexible wiring board disposed, to cause the conductive particles to enter the organic film, and connecting the wiring pattern with the wiring terminal by means of the conductive particles.