| 摘要 |
The present invention provides the following: a laminated structure which exhibits excellent flexibility, which is suitable as an insulating film of a flexible printed wiring board, and especially suitable for integrally forming a folded (curved) section and a mounting (non-curved) section, and which exhibits improved metal plating resistance while suppressing thermal history effects, improving developing properties and stabilizing the shape of an opening; a dry film; and a flexible printed wiring board having a cured product of the laminated structure as a coverlay or a protective film for solder resist and the like. The laminated structure has a resin layer (A) and a resin layer (B), which is laminated on a flexible printed wiring board via the resin layer (A). The resin layer (B) comprises a photosensitive thermosetting resin composition that contains an alkali-soluble resin, a photopolymerization initiator and a thermally reactive compound, and the resin layer (A) comprises an alkali-developable resin composition that contains an alkali-soluble resin, a thermally reactive compound and an organic acid salt of melamine or a mixture of melamine and a boric acid ester. |
