发明名称 IMAGE PICKUP UNIT AND ELECTRONIC ENDOSCOPE INCLUDING THE IMAGE PICKUP UNIT
摘要 An image pickup unit includes: a circuit substrate electrically connected with an image pickup device that detects an image of an object, the circuit substrate including a land at least on a surface thereof; a connecting member having conductivity and fixed to the circuit substrate; a wiring connecting portion provided on the connecting member; a substrate connecting portion extended bent from a side portion of the wiring connecting portion, and electrically connected to a land; and a wiring configured to be connected to the wiring connecting portion and electrically connected to the land through the connecting member.
申请公布号 US2017035279(A1) 申请公布日期 2017.02.09
申请号 US201615297239 申请日期 2016.10.19
申请人 OLYMPUS CORPORATION 发明人 FUJII Toshiyuki
分类号 A61B1/05;G02B23/24;H04N5/225;A61B1/00 主分类号 A61B1/05
代理机构 代理人
主权项 1. An image pickup unit comprising: an image pickup device; a circuit substrate electrically connected with the image pickup device; a connecting member having conductivity and fixed to the circuit substrate; and a cable connected to the circuit substrate and the connecting member, wherein the circuit substrate includes: a bonding substrate portion electrically connected to a rear surface of the image pickup device and having an area substantially same as an area of the rear surface of the image pickup device;a laminated substrate portion extended rearward from a substantially center of the bonding substrate portion;a land for signal line arranged on at least a surface of the laminated substrate portion; anda land for ground arranged on at least the surface of the laminated substrate portion, wherein the connecting member includes: a wiring connecting portion provided superimposed on a proximal end surface of the laminated substrate portion in parallel with the proximal end surface; anda substrate connecting portion extended bent from a side portion of the wiring connecting portion, and electrically connected to the land for ground, and wherein the cable includes: a signal line configured to be connected to the land for signal line; anda shield bundle formed by bundling a ground line of the cable with a shield of the signal line, a distal end of the shield bundle being electrically connected to a plane of the wiring connecting portion which is superimposed on the proximal end surface.
地址 Tokyo JP