发明名称 |
IMAGE PICKUP UNIT AND ELECTRONIC ENDOSCOPE INCLUDING THE IMAGE PICKUP UNIT |
摘要 |
An image pickup unit includes: a circuit substrate electrically connected with an image pickup device that detects an image of an object, the circuit substrate including a land at least on a surface thereof; a connecting member having conductivity and fixed to the circuit substrate; a wiring connecting portion provided on the connecting member; a substrate connecting portion extended bent from a side portion of the wiring connecting portion, and electrically connected to a land; and a wiring configured to be connected to the wiring connecting portion and electrically connected to the land through the connecting member. |
申请公布号 |
US2017035279(A1) |
申请公布日期 |
2017.02.09 |
申请号 |
US201615297239 |
申请日期 |
2016.10.19 |
申请人 |
OLYMPUS CORPORATION |
发明人 |
FUJII Toshiyuki |
分类号 |
A61B1/05;G02B23/24;H04N5/225;A61B1/00 |
主分类号 |
A61B1/05 |
代理机构 |
|
代理人 |
|
主权项 |
1. An image pickup unit comprising:
an image pickup device; a circuit substrate electrically connected with the image pickup device; a connecting member having conductivity and fixed to the circuit substrate; and a cable connected to the circuit substrate and the connecting member, wherein the circuit substrate includes:
a bonding substrate portion electrically connected to a rear surface of the image pickup device and having an area substantially same as an area of the rear surface of the image pickup device;a laminated substrate portion extended rearward from a substantially center of the bonding substrate portion;a land for signal line arranged on at least a surface of the laminated substrate portion; anda land for ground arranged on at least the surface of the laminated substrate portion, wherein the connecting member includes:
a wiring connecting portion provided superimposed on a proximal end surface of the laminated substrate portion in parallel with the proximal end surface; anda substrate connecting portion extended bent from a side portion of the wiring connecting portion, and electrically connected to the land for ground, and wherein the cable includes:
a signal line configured to be connected to the land for signal line; anda shield bundle formed by bundling a ground line of the cable with a shield of the signal line, a distal end of the shield bundle being electrically connected to a plane of the wiring connecting portion which is superimposed on the proximal end surface. |
地址 |
Tokyo JP |