| 主权项 |
1. An adhesion detecting method for detecting the degree of adhesion of a protective tape having an adhesive layer to a wafer in attaching said protective tape to the front side of said wafer, a plurality of division lines being formed on the front side of said wafer to thereby define a plurality of separate regions where a plurality of devices are each formed, said adhesion detecting method comprising:
a protective tape attaching step of attaching said protective tape to the front side of said wafer in the condition where said adhesive layer faces the front side of said wafer; a protective tape peeling step of peeling said protective tape from the front side of said wafer; a first height difference detecting step of imaging an arbitrary specific region on the front side of said wafer to detect a first height difference of first unevenness present on the front side of said wafer; a second height difference detecting step of imaging a corresponding region on said adhesive layer of said protective tape peeled from the front side of said wafer corresponding to said specific region to detect a second height difference of second unevenness formed on said adhesive layer by the transfer of said first unevenness from the front side of said wafer to said adhesive layer; and a determining step of comparing said first height difference and said second height difference with each other and determining whether or not said second height difference falls within an allowable range with respect to said first height difference, wherein when said second height difference falls within said allowable range, the degree of adhesion is determined to pass, whereas when said second height difference falls out of said allowable range, the degree of adhesion is determined to fail. |
