MICROELECTRONIC PACKAGES HAVING SPLIT GYROSCOPE STRUCTURES AND METHODS FOR THE FABRICATION THEREOF

摘要

Methods for fabricating microelectronic packages and microelectronic packages having split gyroscope structures are provided. In one embodiment, the microelectronic package includes a first Microelectromechanical Systems (MEMS) die having a first MEMS gyroscope structure thereon. The microelectronic package further includes a second MEMS die, which has a second MEMS gyroscope structure thereon and which is positioned in a stacked relationship with the first MEMS die. The first and second MEMS gyroscope structures overlap as taken along a first axis orthogonal to a principal axis of the first MEMS die.

主权项

1. A microelectronic package, comprising:
a first Microelectromechanical Systems (MEMS) die having a first MEMS gyroscope structure thereon; and a second MEMS die having a second MEMS gyroscope structure thereon and positioned in a stacked relationship with the first MEMS die, the first and second MEMS gyroscope structures overlapping as taken along a first axis orthogonal to a principal surface of the first MEMS die.