APPARATUS AND METHODS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOUNT DEVICES

摘要

Apparatus and methods related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mound device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.

主权项

1. A radio-frequency (RF) module comprising:
a packaging substrate configured to receive a plurality of components; a surface mound device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted; an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD; an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer; and a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.