COMPONENT BUILT-IN MULTILAYER BOARD

摘要

In an LC composite component, a chip capacitor is built in a multilayer substrate including base material layers made of a thermoplastic resin. The number of the base material layers in a portion overlapping the component as seen from a lamination direction is equal to the number of the base material layers in a portion around the component as seen from the lamination direction. Wiring patterns that adjust the thickness of the multilayer substrate are provided around the chip capacitor as seen from the lamination direction, and on principal surfaces of the base material layers, so as to surround the chip capacitor.

主权项

1. A component built-in multilayer board comprising
a multilayer substrate including a plurality of laminated base material layers made of a thermoplastic resin; and a component built in the multilayer substrate; wherein in the multilayer substrate, a number of the laminated base material layers in a portion overlapping the component as seen from a lamination direction is equal to a number of the laminated base material layers in a portion around the component as seen from the lamination direction; and a thickness adjustment member that adjusts a thickness of the multilayer substrate is provided on a principal surface of at least one of the base material layers and around the component as seen from the lamination direction, so as to surround the component.