| 发明名称 |
METHOD FOR PROTECTING AN ELECTRONIC CIRCUIT CARRIER AGAINST ENVIRONMENTAL INFLUENCES AND CIRCUIT MODULE |
| 摘要 |
The present disclosure provides a method for protecting an electronic interconnect device from environmental effects. The electronic interconnect device may be connected to at least one electronic component, wherein the electronic interconnect device and the at least one electronic component are at least partially covered with an encapsulating material in a material-bonded manner. The method may include applying the encapsulating material to the electronic interconnect device with a 3D printer during a 3D printing process. |
| 申请公布号 |
US2017042031(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201515304768 |
申请日期 |
2015.03.25 |
| 申请人 |
ZF Friedrichshafen AG |
发明人 |
Robin Hermann Josef |
| 分类号 |
H05K1/18;H05K3/28 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for protecting an electronic interconnect device from environmental effects, wherein the electronic interconnect device is connected to at least one electronic component, wherein the electronic interconnect device and the at least one electronic component are at least partially covered with an encapsulating material in a material-bonded manner, the method comprising:
applying the encapsulating material to the electronic interconnect device with a 3D printer during a 3D printing process. |
| 地址 |
Friedrichshafen DE |
