| 发明名称 |
SEMICONDUCTOR DEVICE WITH PROTECTIVE MATERIAL AND METHOD FOR ENCAPSULATING |
| 摘要 |
A semiconductor device includes a plurality of wire bonds formed on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; a protective material is applied around the plurality of wire bonds, the protective material having a first pH; and at least a portion of the semiconductor device and the protective material are encapsulated with an encapsulating material having a second pH, wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds. |
| 申请公布号 |
US2017040282(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
US201615298743 |
申请日期 |
2016.10.20 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
HIGGINS, III Leo M. |
| 分类号 |
H01L23/00;H01L23/29;H01L21/56;H01L23/31 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An encapsulated semiconductor device, comprising:
a plurality of wire bonds formed on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; a protective material applied around the plurality of wire bonds, the protective material having a first pH; and at least a portion of the semiconductor device and the protective material encapsulated with an encapsulating material having a second pH, wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds. |
| 地址 |
AUSTIN TX US |
