INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METHODS OF MANUFACTURE

摘要

Dies (110) with integrated circuits are attached to a wiring substrate (120), possibly an interposer, and are protected by a protective substrate (410) attached to a wiring substrate. The dies are located in cavities in the protective substrate (the dies may protrude out of the cavities). In some embodiments, each cavity surface puts pressure on the die to strengthen the mechanical attachment of the die the wiring substrate, to provide good thermal conductivity between the dies and the ambient (or a heat sink), to counteract the die warpage, and possibly reduce the vertical size. The protective substrate may or may not have its own circuitry connected to the dies or to the wiring substrate. Other features are also provided.

主权项

1. A method for fabricating an electrically functioning apparatus, the method comprising:
(a) obtaining an assembly comprising: a first substrate; one or more modules attached and electrically connected to the first substrate, each module protruding from a top side of the assembly and comprising one or more semiconductor integrated circuits; (b) forming a first layer on a top side of the assembly, the first layer comprising a top surface overlying the one or more protrusions formed by the one or more modules; (c) obtaining a second substrate comprising one or more cavities; and (d) bonding the second substrate to the assembly, with at least part of each semiconductor integrated circuit being located in a corresponding cavity in the second substrate and at least a portion of the first layer being bonded to a surface of a corresponding cavity in the second substrate.