| 发明名称 |
METHOD FOR MANUFACTURING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT |
| 摘要 |
A method for manufacturing an optoelectronic component comprises steps for providing a support, for disposing an ink on a top surface of the support, and for securing an optoelectronic semiconductor chip to the top surface of the support. |
| 申请公布号 |
WO2017021412(A1) |
申请公布日期 |
2017.02.09 |
| 申请号 |
WO2016EP68439 |
申请日期 |
2016.08.02 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
STREITEL, Reinhard;LIN-LEFEBVRE, I-Hsin;OOI, Chee Eng;GALESIC, Ivan |
| 分类号 |
H01L33/54;H01L33/40 |
主分类号 |
H01L33/54 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
