发明名称 |
LENS SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS |
摘要 |
Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like. |
申请公布号 |
WO2017022193(A1) |
申请公布日期 |
2017.02.09 |
申请号 |
WO2016JP03372 |
申请日期 |
2016.07.19 |
申请人 |
SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
发明人 |
SHIRAIWA, Toshiaki;OKAMOTO, Masaki;MATSUGAI, Hiroyasu;ITOU, Hiroyuki;SAITO, Suguru;OHSHIMA, Keiji;FUJII, Nobutoshi;TAZAWA, Hiroshi;ISHIDA, Minoru |
分类号 |
B29D11/00;G02B3/00 |
主分类号 |
B29D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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