SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate.

主权项

1. A method for manufacturing a semiconductor device, comprising:
forming an electrical isolation layer on a surface of a semiconductor wafer, the electrical isolation layer abutting the semiconductor wafer; attaching an adhesive layer to the electrical isolation layer; dicing the semiconductor wafer and the electrical isolation layer to form a monolithic structure, the monolithic structure comprising a semiconductor die; and adhering the monolithic structure to a substrate via the adhesive layer, wherein the adhesive layer is disposed between the electrical isolation layer and the substrate, the electrical isolation layer being harder than the adhesive layer.