发明名称 |
INTEGRATED CIRCUIT CHIP ATTACHMENT USING LOCAL HEAT SOURCE |
摘要 |
Integrated circuit chip attachment is described using a local heat source. In one example an interposer has a top side to connect to a silicon component and a bottom side to connect to a circuit board, the top side having a plurality of contact pads to electrically connect to the silicon component using solder. The interposer a plurality of heater traces having connection terminals. A removable control module attaches over the interposer and silicon component to conduct a current to the heater connection terminals to heat the heater traces, to melt a solder on the contact pads of the interposer and to form a solder joint between the component and the interposer. |
申请公布号 |
EP3127150(A1) |
申请公布日期 |
2017.02.08 |
申请号 |
EP20140888037 |
申请日期 |
2014.03.29 |
申请人 |
Intel Corporation |
发明人 |
BOYD, Thomas Alan;SHIER, Daniel Edward;VOGMAN, Victor;THIBADO, Jonathan William;HEPPNER, Joshua David |
分类号 |
H01L23/34;H05K7/20 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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