发明名称 配線基板および電子装置
摘要 PROBLEM TO BE SOLVED: To provide a wiring board including a wiring conductor which is excellent in oxidation resistance.SOLUTION: A wiring board 1 includes: an insulation base material 11; and a wiring conductor 12 including a conductor layer 12a provided on the insulation base material 11, a first plating layer 12b provided on a surface of the conductor layer 12a, and a second plating layer 12c provided on a surface of the first plating layer 12b. The wiring conductor 12 includes a protection layer 12d which covers a side surface of the first plating layer 12b and includes a metal material having oxidation reduction potential larger than the first plating layer 12b as a main component. The wiring board 1 reduces the possibility that the metal material of the first plating layer 12b adheres to the second plating layer 12c.
申请公布号 JP6075606(B2) 申请公布日期 2017.02.08
申请号 JP20120212555 申请日期 2012.09.26
申请人 京セラ株式会社 发明人 釜瀬 祐志
分类号 H05K1/09;H05K3/24 主分类号 H05K1/09
代理机构 代理人
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