| 摘要 |
The invention relates to a method for producing a circuit board having at least one optoelectronic component, which method is characterized by the following steps: a) applying a transparent curable adhesive layer (1) to a carrier layer (2), b) placing at least one optoelectronic component (3) onto the adhesive layer (1) by means of an optically relevant side (4) of the component, c) curing the adhesive layer (1) into a window element (1'), d) embedding the component (3) in a circuit-board composite, e) structuring the carrier layer (2) in order to at least partially expose the window element (1') and to contact the component (3). |
