| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for an electronic component mounting apparatus by which accuracy of holding or attachment of an electronic component can be improved.SOLUTION: An electronic component mounting apparatus uses holding means for mounting electronic components by holding or attachment using mounting conditions including height. This mounting apparatus includes: means for determining positional information of the electronic component retained or attached using designated mounting conditions; means for determining variations in the position of the electronic component for each of the mounting conditions using a plurality pieces of determined positional information; and means for determining new mounting conditions for the electronic component using the variations determined. |
