Method to manufacture an optoelectronic assembly

摘要

A method to manufacture an optoelectronic assembly comprises a step of structuring a first wafer to provide a plurality of optical components to change a beam of light in the optoelectronic assembly with a respective alignment structure being formed to couple the respective optical component to an optical connector. A second wafer is provided with a plurality of optoelectronic components. The first and second wafer are stacked on top of each other, aligned and bonded together. The bonded first and second wafers are separated into a plurality of optoelectronic modules. The optical connector is manufactured by structuring a third wafer so that the third wafer is provided with a plurality of optical connectors. The third wafer is separated into a plurality of the optical connectors. The optical fiber is coupled to one of the optical connectors and then is coupled to one of the separated optoelectronic modules.

主权项

1. A method to manufacture an optoelectronic assembly comprising an optical connector to couple at least one optical fiber to the optoelectronic assembly, an optical component to change a beam of light in the optoelectronic assembly and an optoelectronic component to convert the light into an electric signal or to convert the electric signal into the light, comprising:
providing at least one optical fiber; providing the optical connector with a material being transparent for the light transferred in the at least one optical fiber, wherein the optical connector comprises a first coupling and aligning structure for coupling the at least one optical fiber to the optical connector and a second coupling and aligning structure for coupling the optical connector to the optical component; providing a first wafer with a material being transparent for the light transferred in the optical fiber; providing a second wafer comprising a plurality of identical ones of the optoelectronic component, wherein each of the optoelectronic components comprises a respective optoelectronic device to convert the light into the electric signal or to convert the electric signal into the light; structuring the first wafer to provide a plurality of identical ones of the optical components with a respective alignment structure being formed to couple the respective optical component to the optical connector; stacking and aligning the first and second wafer so that the light coupled in the respective alignment structure of the optical components of the first wafer is focused on a respective active area of the optoelectronic devices of the second wafer; bonding the first and the second wafer on top of each other; separating the bonded first and second wafer into a plurality of the optoelectronic modules, wherein each of the optoelectronic modules comprises one of the optoelectronic components and one of the optical components; coupling the at least one optical fiber to the optical connector; and coupling the optical connector to one of the plurality of the separated optoelectronic modules by coupling the second coupling and aligning structure of the optical connector to the alignment structure of said one of the separated optoelectronic modules.