| 发明名称 | Electrodeposited copper foil | ||
| 摘要 | An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries. | ||
| 申请公布号 | US9562298(B2) | 申请公布日期 | 2017.02.07 |
| 申请号 | US201414486107 | 申请日期 | 2014.09.15 |
| 申请人 | Chang Chun Petrochemical Co., Ltd. | 发明人 | Chou Jui-Chang;Cheng Kuei-Sen;Lai Yao-Sheng;Lo Hsi-Hsing;Liu Yueh-Min |
| 分类号 | B21C37/00;C25D1/04;C25D3/38 | 主分类号 | B21C37/00 |
| 代理机构 | Polsinelli PC | 代理人 | Polsinelli PC |
| 主权项 | 1. An electrodeposited copper foil, comprising a plane (200) with a texture coefficient of from 50 to 80%, based on a sum of texture coefficients of plane (111), the plane (200), a plane (220) and a plane (311) of the electrodeposited copper foil. | ||
| 地址 | Taipei TW | ||