Assembly having a substrate, an SMD component, and a lead frame part

摘要

An assembly, having a substrate made of an electrically insulating material, an SMD component, which has lateral contact surfaces, and a lead frame part made of metal, which is fastened to the substrate and is used to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly, wherein the lead frame part has contact tongues, which resiliently lie against the lateral contact surfaces and are connected to the lateral contact surfaces in a bonded manner.

主权项

1. An assembly comprising:
a substrate embodied from an electrically insulating material having a depression formed in a face of the substrate; an SMD component arranged in the depression and having lateral contact surfaces; and a stamped lead frame part embodied from metal and fastened to the substrate, the stamped lead frame part configured to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly, wherein the stamped lead frame part comprises contact tongues that lie in a resilient manner against the lateral contact surfaces and are connected by a positive material connection to the lateral contact surfaces, wherein the depression comprises a base and lateral wall faces that extend from the base towards the face, wherein the lateral wall faces are arranged in an inclined manner in the region of the contact tongues, so that an angle in a range from 95° to 140° is produced between a lateral wall face and an adjoining portion of the face defining free space for the contact tongues.