RESIN-CLAD COPPER FOIL, AND PRINTED WIRING BOARD

摘要

The purpose of the present invention is to provide: a resin-clad copper foil which can be produced without irradiation with ultraviolet radiation and by which transmission characteristics can be improved by using a bismaleimide resin having a low dielectric constant and a low dielectric loss tangent; and a printed wiring board that uses the resin-clad copper foil. Provided are a resin-clad copper foil obtained by laminating, on a copper foil, a resin composition which contains a bismaleimide resin represented by general formula (I), a curing agent and a filler, in which the blending quantity of the filler is 10-200 parts by mass relative to 100 parts by mass of resin component, and in which the complex viscosity of the resin composition at 80°C is 1 × 103 to 5 × 105 Pa·s; and a printed wiring board that uses the resin-clad copper foil. In general formula (I), X denotes an aliphatic, alicyclic or aromatic hydrocarbon group having 10-30 carbon atoms in the main chain, Y denotes an aliphatic, alicyclic or aromatic hydrocarbon group, and n denotes a number in the range 1-20.