摘要 |
A temperature sensor of the present invention is provided with a pair of lead frames 2, a sensor section 3 connected to the lead frames, and an insulating holding section 4 that holds the lead frames. The sensor section is provided with: an insulating film 5 having the lead frames bonded on the upper surface; a thin film thermistor section 6 formed on the insulating film; a pair of interdigital electrodes 7 formed on the thin film thermistor section; a pair of pattern electrodes formed on the upper surface of the insulating film; and a pair of protection tapes 9A, 9B, which are bonded to each other by vertically sandwiching therebetween the pair of lead frames and the sensor section. Both side sections 5a of the insulating film are disposed close to and on the inner sides of outer corner sections 2b that are disposed on the bonding surface sides of the pair of lead frames, and both side sections 9a of the protection tapes are bent on the outer side of both the side sections of the insulating film, said side sections 9a being bent toward the upper surface side. |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
NAGATOMO, Noriaki;MATSUMOTO, Fumio;INABA, Hitoshi;TAKESHIMA, Kazuta;YAMAGUCHI, Kunio;TANAKA, Hiroshi |