发明名称 MOSFET WITH ULTRA LOW DRAIN LEAKAGE
摘要 A semiconductor device includes a monocrystalline substrate configured to form a channel region between two recesses in the substrate. A gate conductor is formed on a passivation layer over the channel region. Dielectric pads are formed in a bottom of the recesses and configured to prevent leakage to the substrate. Source and drain regions are formed in the recesses on the dielectric pads from a deposited non-crystalline n-type material with the source and drain regions making contact with the channel region.
申请公布号 US2017033203(A1) 申请公布日期 2017.02.02
申请号 US201615287854 申请日期 2016.10.07
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 de Souza Joel P.;Fogel Keith E.;Kim Jeehwan;Sadana Devendra K.
分类号 H01L29/66;H01L29/08;H01L21/02 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method for forming a transistor, comprising: forming a passivation layer on a monocrystalline substrate; forming a gate conductor over a channel region of the substrate; etching recesses in the substrate through the gate dielectric, the recesses extending below a portion of the passivation layer in undercut regions; depositing a dielectric material that forms on the passivation layer, forms a gate cap material and forms dielectric pads in a bottom of the recesses; and forming source and drain regions in the recesses on the dielectric pads from an n-type material with the source and drain regions making contact with the channel region.
地址 Armonk NY US