| 摘要 |
The present technology relates to a semiconductor device with which a chip size package can be more simply realized using a flexible printed board, a method for manufacturing the same, and an electronic device. Provided is a semiconductor device provided with: a solid-state image capture element including a pixel array portion in which a plurality of pixels including photoelectric conversion elements are disposed two-dimensionally in a matrix; and a flexible printed board including wiring for connecting a pad portion disposed on an upper surface side of the solid-state image capture element, which is a light receiving surface side thereof, to an external terminal disposed on a lower surface side on the opposite side from the upper surface side, wherein the flexible printed board is disposed along each surface of the solid-state image capture element in such a way that an end portion of the flexible printed board on the upper surface side of the flexible printed board is disposed in a position different from a position in a space above the light receiving surface. The present technology can be applied when packaging a CMOS image sensor, for example. |
