HYBRID COMPUTING MODULE

摘要

A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core dock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.

主权项

1. A hybrid computing module comprising:
a plurality of semiconductor die mounted upon a carrier comprising a substrate that provides signal communication between a plurality of said semiconductor die and passive circuit elements formed upon the carrier substrate; a fully integrated power management circuit module having a resonant gate transistor that switches electrical power at speeds that synchronously transfer data and digital process information sets between said plurality of semiconductor dies; at least one microprocessor die among the plurality of semiconductor die; and, a memory bank; and, at least one electro-optic interface.