| 发明名称 |
SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING THEREOF, AND ELECTRONIC APPARATUS |
| 摘要 |
Provided is a solid-state image pickup device including: a plurality of pixels, each of which includes a photoelectric conversion portion and a pixel transistor formed in a front surface side of a substrate, wherein a rear surface side of the substrate is set as a light receiving plane of the photoelectric conversion portion; and an element, which becomes a passive element or an active element, which is disposed in the front surface side of the substrate so as to be superimposed on the photoelectric conversion portion. |
| 申请公布号 |
US2017033146(A1) |
申请公布日期 |
2017.02.02 |
| 申请号 |
US201615293220 |
申请日期 |
2016.10.13 |
| 申请人 |
Sony Corporation |
发明人 |
Kiyota Yukihiro;Mabuchi Keiji |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A solid-state image pickup device comprising:
a plurality of pixels, at least one pixel including a photoelectric conversion portion and a pixel transistor embedded within a semiconductor substrate at a front surface side of the semiconductor substrate, wherein a rear surface side of the semiconductor substrate corresponds to a light receiving plane of the photoelectric conversion portion; and an active or passive pixel element disposed within the front surface side of the semiconductor substrate so as to be superimposed on the photoelectric conversion portion. |
| 地址 |
Tokyo JP |
