发明名称 |
LIGHT CURABLE RESIN COMPOSITION |
摘要 |
The present application relates to a resin composition and in particular to a light-curable resin composition.;It is known to achieve a thixotropic behavior of an adhesive composition by adding an inorganic additive like fumed silica. Adding inorganic additives results in significant particle problems as fumed silica is a solid particle and affects the optical performance of the adhesive composition.;In accordance with the invention a particle free resin composition with a thixotropic behavior is provided. The inventive composition comprises
a) 30 to 90 wt % of a urethane acrylate oligomer with a molecular weight greater than 15000,b) 2 to 40 wt % of a (meth)acrylate monomer having a benzene ring, andc) 0.2 to 10 wt % of a photo initiator. |
申请公布号 |
US2017029671(A1) |
申请公布日期 |
2017.02.02 |
申请号 |
US201615293957 |
申请日期 |
2016.10.14 |
申请人 |
Henkel AG & Co. KGaA |
发明人 |
Sawanobori Junichi;Chen Chunfu;Kanari Masao |
分类号 |
C09J135/00;G02F1/1333;G02F1/1335 |
主分类号 |
C09J135/00 |
代理机构 |
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代理人 |
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主权项 |
1. A light-curable resin composition, comprising
a) 30 to 90 wt % of a urethane acrylate oligomer with a molecular weight greater than 15000, b) 2 to 40 wt % of a (meth)acrylate monomer having a benzene ring, c) 0.2 to 10 wt % of a photo initiator. |
地址 |
Duesseldorf DE |