Systems and Methods for Reinforced Adhesive Bonding

摘要

A bonding system (100) comprises a first substrate (110) having a first contact surface (115) comprising a plurality of protuberances (130), a second substrate (120) having a second contact surface (125), an adhesive (200) in contact with the first contact surface (115) and the second contact surface (125), and a plurality of solder balls (300) positioned in the adhesive between the first contact surface (115) and the second contact surface (125). A bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and second substrate (120), comprises applying an adhesive (200) on a first contact surface (115), of the first substrate (110), including a plurality of protuberances (130), positioning, at least partially into the adhesive (200), each a plurality of solder balls (300), and connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125).

主权项

1. A bonding system, comprising:
a first substrate having a first contact surface comprising a plurality of protuberances; a second substrate having a second contact surface; an adhesive in contact with the first contact surface and the second contact surface; and a plurality of solder balls positioned between the first contact surface and the second contact surface.