| 发明名称 |
Thermally Conductive Polymer Composition |
| 摘要 |
A polymer composition that has an in-plane thermal conductivity of about 2.0 W/m-K or more is provided. The composition comprises 100 parts by weight of at least one aromatic polymer; from about 10 to about 50 parts by weight of an inorganic material having a hardness value of about 2.5 or more based on the Mohs hardness scale; and from about 20 to about 80 parts by weight of a thermally conductive particulate material having an average size of from about 1 to about 100 micrometers. |
| 申请公布号 |
US2017029682(A1) |
申请公布日期 |
2017.02.02 |
| 申请号 |
US201615221699 |
申请日期 |
2016.07.28 |
| 申请人 |
Ticona LLC |
发明人 |
Kim Young Shin;McCullough Kevin A.;Zhao Xinyu |
| 分类号 |
C09K5/14;H04N5/225;C08K3/22;C08K3/32;C08K3/38 |
主分类号 |
C09K5/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polymer composition having an in-plane thermal conductivity of about 2.0 W/m-K or more, wherein the composition comprises:
100 parts by weight of at least one aromatic polymer; from about 10 to about 50 parts by weight of an inorganic material having a hardness value of about 2.5 or more based on the Mohs hardness scale; and from about 20 to about 80 parts by weight of a thermally conductive particulate material having an average size of from about 1 to about 100 micrometers. |
| 地址 |
Florence KY US |
