| 摘要 |
A stencil printer (10) includes a stencil shuttle assembly (18) coupled to a frame (12). The stencil shuttle assembly is configured to move the stencil (16) in an x-axis direction between a first position in which the stencil is positioned toward a front of the stencil printer and a second position in which the stencil is positioned toward a back of the stencil printer. The stencil shuttle assembly (18) further is configured to move the stencil (16) in a y-axis direction to align the stencil. The stencil printer further includes a wiper (164) to remove material from the stencil as the stencil is translated away from the substrate (24) by the stencil shuttle assembly. The stencil shuttle assembly, when the stencil is translated away from the substrate, is configured to move the stencil (16) in the y-axis direction in an oscillating manner. Methods of cleaning a stencil are further disclosed. |
