发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD
摘要 A photosensitive resin composition which contains (A) a binder polymer, (B) a photopolymerizable compound and (C) a photopolymerization initiator, and wherein: the binder polymer (A) has a structural unit derived from a (meth)acrylic acid; and the refractive index of the binder polymer (A) is 1.504 or more.
申请公布号 WO2017018053(A1) 申请公布日期 2017.02.02
申请号 WO2016JP66474 申请日期 2016.06.02
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 NAGOSHI Toshimasa;KUME Masakazu
分类号 G03F7/033;G03F7/004;G03F7/027;G03F7/029;H05K3/06;H05K3/18 主分类号 G03F7/033
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