| 摘要 |
PROBLEM TO BE SOLVED: To provide a granular resin composition optimum for compression molding in which occurrence of fine powder generated by rubbing between granules is less, with cohesion being hard to occur.SOLUTION: In a method of manufacturing resin composition for granular semiconductor sealing, the composition containing thermo setting resin, inorganic filler, and curing acceleration as essential components is subjected to melt-kneading by using single axis or double axes kneading extruder, and is made to pass a T die, installed at a tip end, having a plurality of slits with an interval being 0.5-2.0 mm, and further it is cooled, to provide a string-like kneaded composition. Then, the kneaded composition is granulated by a crushing type granulator equipped with a cylindrical screen. |
