| 摘要 |
The present invention is related to a method of bonding two elements comprising:
- producing on a first element (1) a first micropattern (2), comprising a first metal layer
- producing on a second element (3) a second micropattern (4), comprising a second metal layer;
- applying onto said first micropattern and/or on said second micropattern a layer (5) of solder material;
- joining the first micropattern and the second micropattern by means of a thermocompression or reflow method,
characterized in that the method further comprises the step of producing on at least one element a patterned non-conductive adhesive layer (10) around the micropattern on said element, said adhesive layer being applied before said joining step, so that after the joining step, the elements are secured to each other by said adhesive layer(s). |
