| 摘要 |
The element (10) has a flooring layer (30) spaced at a distance from another flooring layer (20). A carrier element (40) is arranged between the flooring layers and supports a line device (60). The carrier element includes contact surfaces (51, 52) staying in thermally conductive contact with the respective flooring layers. The carrier element includes a contact section (53), which stays in thermally conductive contact with the line device. The contact section is formed by an opening (41), where the line device is accommodated in the line device by force-fit. |
