发明名称 |
Acoustic transducer |
摘要 |
A silicon substrate has a chamber that penetrates vertically. A diaphragm is formed on the upper surface of the silicon substrate so as to cover the upper portion of the chamber. Also, a back plate is provided above the silicon substrate so as to cover the diaphragm, and a fixed electrode plate is provided on the lower surface of the back plate in opposition to the diaphragm. Multiple acoustic holes, which penetrate vertically and are for allowing the passage of acoustic vibration, are formed in the back plate (28) and the fixed electrode plate. Multiple through-holes that have a smaller opening area than the acoustic holes are formed in a large displacement region of the diaphragm. |
申请公布号 |
US9560454(B2) |
申请公布日期 |
2017.01.31 |
申请号 |
US201314772084 |
申请日期 |
2013.09.09 |
申请人 |
OMRON Corporation |
发明人 |
Kasai Takashi |
分类号 |
H04R25/00;H04R19/00;H04R19/04;H04R31/00 |
主分类号 |
H04R25/00 |
代理机构 |
Mots Law, PLLC |
代理人 |
Mots Law, PLLC |
主权项 |
1. An acoustic transducer comprising:
a substrate having a cavity that is open at least at an upper surface; a vibrating electrode plate formed above the substrate so as to cover an upper portion of the cavity; a back plate formed above the substrate so as to cover the vibrating electrode plate; and a fixed electrode plate provided on the back plate, wherein the back plate and the fixed electrode plate have a plurality of acoustic holes that penetrate vertically, and a plurality of through-holes each having a smaller opening area than each of the acoustic holes are formed in a large displacement region in a central portion of the vibrating electrode plate. |
地址 |
Kyoto-shi JP |