发明名称 Plasma reactor with conductive member in reaction chamber for shielding substrate from undesirable irradiation
摘要 Placing a conductive member between a plasma chamber in a remote plasma reactor and a substrate to shield the substrate from irradiation of undesirable electromagnetic radiation, ions or electrons. The conductive member blocks the electromagnetic radiation, neutralizes ions and absorbs the electrons. Radicals generated in the plasma chambers flows to the substrate despite the placement of the conductive member. In this way, the substrate is exposed to the radicals whereas damages to the substrate due to electromagnetic radiations, ions or electrons are reduced or removed.
申请公布号 US9558963(B2) 申请公布日期 2017.01.31
申请号 US201514869627 申请日期 2015.09.29
申请人 Veeco ALD Inc. 发明人 Lee Sang In;Lee Ilsong;Yang Hyo Seok
分类号 C23C16/50;C23C16/44;H01L21/322;H01L21/02;C23C16/30;C23C16/34;C23C16/40;C23C16/455;H01J37/32 主分类号 C23C16/50
代理机构 Fenwick & West LLP 代理人 Fenwick & West LLP
主权项 1. A plasma reactor comprising: a body formed with: a plasma chamber configured to receive gas and generate radicals of the gas by plasma,a reaction chamber configured to inject the generated radicals onto a substrate passing by the reaction chamber, andat least one perforation formed in the body of the plasma reactor between the plasma chamber and the reaction chamber, the radicals travelling from the plasma chamber to the reaction chamber via the at least one perforation; and a single conductive member placed in the reaction chamber between the substrate and the at least one perforation to shield the substrate from undesirable irradiation generated in the plasma chamber by blocking straight linear paths between the plasma chamber and the substrate, the single conductive member having a width equal to or larger than a width of the at least one perforation and having a curved surface at least a portion of which faces the at least one perforation, the generated radicals flowing around the curved surface of the single conductive member to the substrate via paths between the single conductive member and the reaction chamber.
地址 Fremont CA US